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Servisol | Heatsink Compound

Heat sink pastes and heat sink grease are designed to efficiently transfer heat away from the heat generating component. For electrical applications, the heat sink compound is used to thermally bond a component with a mechanical heat sink. The compound fills the gap between the CPU (central processing unit) or other heat generating components.

In addition, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Although heat sink compound does not have the thermal conductivity of metals like copper and silver, the improvement over air will increase thermal responsiveness.

FEATURES & SPECIFICATION:
- Designed to efficiently transfer heat away from the heat generating component
- Contents 25g
- Thermally bond a component

40:T821,